晶诺威科技贴片晶振33.33MHz电气参数：

贴片晶振33.33MHz封装尺寸：

贴片晶振33.33MHz回流焊作业指导说明：

Recommended Reflow Soldering Condition (SMD)

Solder profile

Peak: 245±5℃ Soldering zone: 230℃ or more, 30±10s. Pre-heating zone 1: 150～180℃, 90±30s

Temperature profile for reflow soldering

Soldering iron method

Bit temperature: 350±10℃ Application time of soldering iron:3+1 s. For other procedures, refer to IEC 60068-2-20.

了解更多关于贴片晶振33.33MHz应用及生产交期问题，请联系晶诺威在线客服。