Why are crystal packages getting smaller? 为什么晶体谐振器封装越来小？

Miniaturisation is an ongoing trend in the electronics industry. Wearables, smart home devices and mobile devices are just a few examples demanding progressively smaller components. However, this size reduction can cause issues during the designing process – in general, the smaller the crystal blank, the higher the starting frequency.

微型化是电子行业的一个持续趋势。可穿戴设备、智能家居设备和移动设备只是需要越来越小部件的几个例子。然而，这种尺寸缩小在设计过程中可能会带来问题——一般来说，晶体毛坯越小，起始频率越高。

For example, the lowest frequency in a 7x5mm package is approximately 6MHz, whereas it is approximately12MHz in a 2.5x2mm package. Achieving lower frequencies in smaller packages is done through external frequency division, which, in turn, increases circuit complexity.

例如，7.0×5.0mm封装的频率约为6MHz，而2.0×1.6mm封装的频率约为16MHz。在更小封装中实现较低频率是通过外部频率分频实现的，这反过来增加了电路复杂度。